The encap­su­la­ted O‑ring widens the poten­ti­al app­li­ca­ti­ons of the O‑ring.
The core of the ring is made of sili­co­ne (VMQ) or fluo­ro­elas­to­mer (FKM). The plastic FEP (tetra­fluo­roethy­le­ne-hexa­fluo­ro­pro­py­le­ne) is used for the seam­less encap­su­la­ti­on. The par­ti­cu­lar pro­duct advan­ta­ge lies in the com­bi­na­ti­on of the elasti­ci­ty of the O‑ring and the che­mi­cal resis­tan­ce of the fluo­ro­plastic.

• Che­mi­cal resis­tan­ce simi­lar to
• PTFE Wide tem­pe­ra­tu­re ran­ge 
• Phy­sio­lo­gi­cal­ly safe, ste­ri­li­sable 
• Low fric­tion, no stick-slip effect 
• No sti­cking after long shut­down 
• Can also be used in some cases for slow rota­ry and line­ar moti­on 
• Dry run­ning is pos­si­ble if the­re is litt­le dyna­mic action at the seal

From ‑60 to +200 °C

but depen­dent on the encap­su­la­ted O‑ring mate­ri­al in each case.

IDG encap­su­la­ted O‑ring mate­ri­al

• FEP/VMQ
• FEP/FKM

Mate­ri­al descrip­ti­on and other mate­ri­als for wider app­li­ca­ti­ons FIND OUT MORE >