The encap­su­lated O-ring widens the poten­tial applic­a­tions of the O-ring.
The core of the ring is made of sil­ic­one (VMQ) or fluoroelast­omer (FKM). The plastic FEP (tet­ra­fluoro­ethyl­ene-hex­a­fluoro­p­ro­pyl­ene) is used for the seam­less encap­su­la­tion. The par­tic­u­lar product advant­age lies in the com­bin­a­tion of the elasti­city of the O-ring and the chem­ic­al res­ist­ance of the fluoroplastic.

• Chem­ic­al res­ist­ance sim­il­ar to
• PTFE Wide tem­per­at­ure range 
• Physiolo­gic­ally safe, sterilisable 
• Low fric­tion, no stick-slip effect 
• No stick­ing after long shutdown 
• Can also be used in some cases for slow rotary and lin­ear motion 
• Dry run­ning is pos­sible if there is little dynam­ic action at the seal

From -60 to +200 °C

but depend­ent on the encap­su­lated O-ring mater­i­al in each case.

IDG encap­su­lated O-ring material

• FEP/VMQ
• FEP/FKM

Mater­i­al descrip­tion and oth­er mater­i­als for wider applic­a­tions FIND OUT MORE >